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Leybold Z 590 ( Cleanroom cathode-sputtering system for R&D and production )

Features

Sputter-down system, 6 cathodes PK 150 (150mm dia.), cathodes with dia.=75mm and dia.=100mm possible using adaption flanges.

4 cathodes PK 200 (200mm dia.) possible!

Automatic load-lock ( Option: fully automatic magazine load-lock possible! - Reference available ).

Radial/axial-motion drive system for substrate table. Distance between cathodes and top surfaces of substrate table user-adjustable over the range 50mm - 120mm.
Operating modes:
- Static: Each substrate can be positioned under a selected cathode.
- Dynamic: Substrate carrier is continuously rotating at a user-adjustable rate of 2rpm - 10 rpm.
- Oscillatory: Each substrate can oscillate at a selected cathode; angular excursions are user-adjustable over the ranges +/- 0ƒ and +/-90ƒ.

Sputter mode RF/DC, with or without RF-Bias.

RF-etching.

Presputtering shutter.

Microprozessor-controlled. 40 recipies can be stored from 120 programmable layers.

9"-terminal for operation and visualization.

Pumping system: D65BCS and TMP 1000, Load Lock D8B.

Optional, machine can be made more fashionable using Simatic-PLC and PC for process values, visualisation on a 19" TFT and datalogging.

please ask for more details

System Dimensions, Weight

Pictures Leybold Z590

Upper matchbox, view greyroom

Upper matchbox and loadlock, view cleanroom

Plant with loadlock-door open, view cleanroom

Terminal for prozess visualization and auto-match unit

Plant with all doors open, view cleanroom. There are three doors on greyroom side!

Process chamber, view cleanroom

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