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Leybold Z 550 ( Sputter-center for R&D )


Features

Sputter-down system, 4 cathodes PK 150 ( 150mm dia. ), cathodes with dia. =75mm and dia. =100mm possible by using adaption flanges.

3 cathodes PK 200 (200mm dia.) although possible or 2 cathodes PK150 and 2 cathodes PK200, both on opposite sides (180).

Without loadlock. Optional semi-automatic load-lock available.

Substrate-table with 4 substrate positions.

Deposition mode static, dynamic or with oscillation.

Sputter mode RF/DC, with or without RF-Bias.

RF-etching.

Presputter-shutter available in different shapes.

PLC controlled. 40 Recipies can be stored from 120 programmable layer-types.

9"-terminal for visualisation.

Pumping system: D40B and TMP 450, load-lock D8B.

Optional, system can be upgraded using Simatic-S7 PLC and PC for process values, visualisation and datalogging.

please ask for more details


System Dimensions, Weight


Pictures Leybold Z550


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